先進封裝 EDA 工具開發與智能服務計畫

This product leverages AI generative models to enhance advanced packaging analysis and design, addressing the efficiency and accuracy limitations of traditional EDA tools. Key features include a 600% improvement in computational efficiency, 2.95% error rate, and fast reverse engineering for material analysis. It effectively solves thermal and warpage challenges in 2.5D/3D packaging and has been validated by partners like ASE Group and ITRI.
本產品基於AI生成式模型，提供先進封裝分析與設計服務，解決傳統EDA工具在效率和精度上的限制。其特點包括運算效率提升600%、誤差率僅2.95%、快速進行材料分析與反向設計，並針對2.5D/3D封裝的散熱與翹曲問題提供有效解決方案。目前已獲日月光與工研院等合作夥伴的驗證。